Responsible for supporting multiple groups within the IPG Photonics organization.  The Technician will be responsible for dicing, inspecting and picking high volumes of critical components and materials, to the highest level of quality and efficiency possible, through the use of Fully Automated Dicing Saws/Pick and Place equipment. Key metrics include quality, efficiency, communication, and knowledge of tools. Follow Standard Operating Procedures in order to manufacture products to the specifications required. Mount substrates on fixtures in preparation for dicing. Setup tools with appropriate assemblies based on product type. Load appropriate recipes and material into machine. Perform in-process dimensional inspection to verify critical dimensions are within tolerance. Perform visual inspection, using microscope to identify defects for potentially 4-8 hours per day. Clean processed material through chemical bath process or surface wipe technique. Keep accurate records via logs, labels, and online database. Maintain clean and neat work area, Tools in good working order. Reduce Scrap